KOR

Semiconductor & Display Equipment

Vacuum Dry Oven

Features

  • Ensures temperature uniformity through precise PID control.
  • Touchscreen interface for easy operation.
  • Equipped with multiple safety systems against potential hazards.
  • Supports remote control and data logging.
  • Automated loading/unloading mechanism.
  • Multi-step temperature programming operation.

Specifications

  • Operating Temperature: RT ~ 400℃, 10℃/min
  • Vacuum Level: 0.01 torr (within 30 min)
  • Chamber Capacity: 2,000 liters

Applications

  • Semiconductor, LCD, OLED, Laboratory

Cluster Transfer Module & Load Lock Chamber

Overview

The Load Lock Chamber serves as a buffer module that transitions pressure between atmospheric and vacuum states, positioned between the vacuum and ambient chambers. The Cluster Transfer Module transports glass substrates from the load lock to the process chamber with precision and reliability.

Specifications

  • Glass Size Compatibility: 4G ~ 8G
  • Wafer Size Compatibility: 4" ~ 12"
  • Vacuum Rate: 5 × 10-7 torr
  • Material: Aluminum or Stainless Steel (STS)

Applications

  • Semiconductor, LCD, OLED

Burn-in Test Chamber

Overview

The Burn-in Test Chamber installs devices (packages) on burn-in boards and subjects them to repeated temperature cycling (low to high) within the chamber. This process applies both electrical signals and thermal stress to validate the reliability and endurance of semiconductor devices under extreme conditions.

Features

  • PID temperature control for high uniformity.
  • Easy-to-use touchscreen operation.
  • Comprehensive safety interlocks to prevent overheating.
  • Remote monitoring and data logging capability.
  • Automatic loading system for improved workflow.
  • Multi-stage temperature programming control.
  • Optional Auto Shutter System for AVG response.

Applications

  • Semiconductor, LCD, OLED, Laboratory

Chamber Swing Door

Overview

A swing door system designed for advanced LSI and OLED production chambers, featuring compact design and high sealing performance.

Features

  • Compact swinging mechanism maximizes space efficiency.
  • Flexible installation suitable for diverse chamber environments.
  • Excellent airtight performance (Pressure: 5~20 torr).

Applications

  • LSI, OLED, Laboratory

SIC Curing Oven

Overview

The SIC Curing Oven removes surface impurities or stabilizes wafer structures using radiant heat from Kanthal heaters. This system is widely used for wafer curing and cleaning processes in semiconductor manufacturing.

Features

  • PID-controlled uniform heating performance.
  • Touchscreen for intuitive control and monitoring.
  • Various safety systems against overheating and malfunction.
  • O₂ purge followed by N₂ heat medium supply.
  • Automated loading mechanism for convenience.
  • Multi-step programmable temperature control.

Specifications

  • Operating Temperature: 350℃ (Max 600℃, 18℃/min)
  • Wafer Cassette: Quartz
  • Capacity: 2 Chambers × 1 Cassette (25 Slots each)

Applications

  • Semiconductor, Laboratory